Pentair offers the Schroff Interscale plartform, a new concept for building embedded systems that offers design flexibility and affordable customization for industrial Internet of Things (IoT) applications.
Based on small form factor-boards (e.g. ATX, Micro ATX, Mini ITX, Pico ITX), single-board computers (e.g. Embedded NUC™, Raspberry Pi and Arduino) or a proprietary board, customers can configure a customized case with the modular Schroff Interscale platform. Various electronic components, such as cooling, cutouts, labeling and accessories complete the design. Other services, such as performing simulations and tests, as well as certification support, are offered.
The Schroff Interscale platform is flexible and can be adapted for standard or non-standardized boards. This case platform is based on a parametric model, and can easily be adapted to various heights, widths and depths, depending on the application. The innovative interlocking design of Schroff Interscale cases provides integrated EMC protection of 20 dB at 2 GHz without requiring additional EMC seals. The design ensures a protection class up to IP 30. Depending on the model, the cases consist of either two to four parts that are easily fastened by the use of only two or four screws. The cases can be assembled and taken apart quickly and easily, which reduces integration time. Based on the board type selected, specific interfaces are preconfigured into the case cutouts. These and custom cutouts specified by the customer are a part of the overall Interscale concept.
Electrical components can be integrated, such as a power supply or PCI-/PCIe card installation options and hard-drive mounts. Various cooling options are available, and Schroff Interscale cases can be equipped with perforations and optional fan kits that allow for a variably controlled air stream. Heat is dissipated alternately through conduction cooling using integrated heat sinks and/or flexible heat conductors (FHCs). With the additional installation of the FHC, developed by Pentair, made from aluminum and available in various geometries, conduction cooling performance can be further improved so that a wide spectrum of application needs can be met.
A wide range of powder coating and printing options are available for individualizing the configured system, including logos and photo-realistic images. Services such as the implementation of simulations and tests or receiving support for certification, are also available.